无卤素Tg单面板
Non-halogen Tg Single Sided Plate
HTURK2210S(RA)
| 测试项目/Testing Items | 单位/ Unit | HTWEK1 120S | 测试方法/ Testing Method | ||
| 产品构成/ Composition of product | μm | - | |||
| 铜箔/ Copper foil | 18 | ||||
| 胶粘剂/ Adhesive | 10 | ||||
| Pl膜/ Pl film | 12.5 | ||||
| 总厚度/ Total thickness | 40.5±3 | ||||
| 剥离强度 Peeling intensity | 原始状态/ Original state | N/mm | ≥1.0 | JIS C 6471 8.1.5 | |
| 260C热冲击处理后/After being treated through 260C heat impulsion | ≥1.0 | ||||
| 180C热处理后/ After 180C heat treatment | ≥1.0 | ||||
| 浸药品处理后/ After being soaked in drugs | ≥1.0 | ||||
| 弯曲疲劳(最小值) / Flexural fatigue (min.) | Times | 500 | JIS C 64718.2 | ||
| 表面电阻/ Surface resistance | Ω | 1.0 x 1011 | JIS C 6471 7.1 | ||
| 体积电阻/Volume resistance | 1.0 x 1012 | JIS C 6471 7.2 | |||
| 尺寸稳定性/ Dimensional stability | M.D. | % | -0.2~+0.05 | JIS C 6471 9.6 | |
| T.D. | -0.05~ +0.2 | ||||
| 耐浸焊性/ Solder resistance | ℃ | 300℃/60sec | JIS C 6471 9.3 | ||
| Tg温度/Tg temperature | ℃ | 90 | (TMA) | ||
| 卤素成份/Halogen composition | PPM | 289 | C1 < 900ppm | ||
| 耐燃性/ Burning resistance | Grade | Pass | UL 94V-0/File No.E321938 | ||
HTWEK1120S(ED)
| 测试项目/Testing Items | 单位/ Unit | HTWEK1 120S | 测试方法/ Testing Method | ||
| 产品构成/ Composition of product | μm | - | |||
| 铜箔/ Copper foil | 35 | ||||
| 胶粘剂/ Adhesive | 20 | ||||
| Pl膜/ Pl film | 25 | ||||
| 总厚度/ Total thickness | 80±3 | ||||
| 剥离强度 Peeling intensity | 原始状态/ Original state | N/mm | ≥1.0 | JIS C 6471 8.1.5 | |
| 260C热冲击处理后/After being treated through 260C heat impulsion | ≥1.0 | ||||
| 180C热处理后/ After 180C heat treatment | ≥1.0 | ||||
| 浸药品处理后/ After being soaked in drugs | ≥1.0 | ||||
| 弯曲疲劳(最小值) / Flexural fatigue (min.) | Times | 500 | JIS C 64718.2 | ||
| 表面电阻/ Surface resistance | Ω | 1.0 x 1011 | JIS C 6471 7.1 | ||
| 体积电阻/Volume resistance | 1.0 x 1012 | JIS C 6471 7.2 | |||
| 尺寸稳定性/ Dimensional stability | M.D. | % | -0.2~+0.05 | JIS C 6471 9.6 | |
| T.D. | -0.05~ +0.2 | ||||
| 耐浸焊性/ Solder resistance | ℃ | 300℃/60sec | JIS C 6471 9.3 | ||
| Tg温度/Tg temperature | ℃ | 90 | (TMA) | ||
| 卤素成份/Halogen composition | PPM | 289 | C1 < 900ppm | ||
| 耐燃性/ Burning resistance | Grade | Pass | UL 94V-0/File No.E321938 | ||
无卤素Tg双面板Non-halogen Tg Double Sided Plate
HTURK2210D(RA)
| 测试项目/Testing Items | 单位/ Unit | HTURK2210D | 测试方法/ Testing Method | ||
| 产品构成/ Composition of product | μm | - | |||
| 铜箔/ Copper foil | 18*2 | ||||
| 胶粘剂/ Adhesive | 10*2 | ||||
| Pl膜/ Pl film | 12.5 | ||||
| 总厚度/ Total thickness | 68.5±4 | ||||
| 剥离强度 Peeling intensity | 原始状态/ Original state | N/mm | ≥1.0 | JIS C 6471 8.1.5 | |
| 260C热冲击处理后/After being treated through 260C heat impulsion | ≥1.0 | ||||
| 180C热处理后/ After 180C heat treatment | ≥1.0 | ||||
| 浸药品处理后/ After being soaked in drugs | ≥1.0 | ||||
| 弯曲疲劳(最小值) / Flexural fatigue (min.) | Times | 500 | JIS C 64718.2 | ||
| 表面电阻/ Surface resistance | Ω | 1.0 x 1011 | JIS C 6471 7.1 | ||
| 体积电阻/Volume resistance | 1.0 x 1012 | JIS C 6471 7.2 | |||
| 尺寸稳定性/ Dimensional stability | M.D. | % | -0.2~+0.05 | JIS C 6471 9.6 | |
| T.D. | -0.05~ +0.2 | ||||
| 耐浸焊性/ Solder resistance | ℃ | 300℃/60sec | JIS C 6471 9.3 | ||
| Tg温度/Tg temperature | ℃ | 90 | (TMA) | ||
| 卤素成份/Halogen composition | PPM | 289 | C1 < 900ppm | ||
| 耐燃性/ Burning resistance | Grade | Pass | UL 94V-0/File No.E321938 | ||
HTWEK1120D(ED)
| 测试项目/Testing Items | 单位/ Unit | HTURK2210D | 测试方法/ Testing Method | ||
| 产品构成/ Composition of product | μm | - | |||
| 铜箔/ Copper foil | 35*2 | ||||
| 胶粘剂/ Adhesive | 20*2 | ||||
| Pl膜/ Pl film | 25 | ||||
| 总厚度/ Total thickness | 135±3 | ||||
| 剥离强度 Peeling intensity | 原始状态/ Original state | N/mm | ≥1.0 | JIS C 6471 8.1.5 | |
| 260C热冲击处理后/After being treated through 260C heat impulsion | ≥1.0 | ||||
| 180C热处理后/ After 180C heat treatment | ≥1.0 | ||||
| 浸药品处理后/ After being soaked in drugs | ≥1.0 | ||||
| 弯曲疲劳(最小值) / Flexural fatigue (min.) | Times | 500 | JIS C 64718.2 | ||
| 表面电阻/ Surface resistance | Ω | 1.0 x 1011 | JIS C 6471 7.1 | ||
| 体积电阻/Volume resistance | 1.0 x 1012 | JIS C 6471 7.2 | |||
| 尺寸稳定性/ Dimensional stability | M.D. | % | -0.2~+0.05 | JIS C 6471 9.6 | |
| T.D. | -0.05~ +0.2 | ||||
| 耐浸焊性/ Solder resistance | ℃ | 300℃/60sec | JIS C 6471 9.3 | ||
| Tg温度/Tg temperature | ℃ | 90 | (TMA) | ||
| 卤素成份/Halogen composition | PPM | 289 | C1 < 900ppm | ||
| 耐燃性/ Burning resistance | Grade | Pass | UL 94V-0/File No.E321938 | ||
无胶系列产品
Non-gel Series of Products
单面高延展性(铜箔基材)
High ductibility of single side (copper-foil base material)
单面压延(铜箔基材)
Single side calendaring (copper-foil base material)
产品性能 Product Performance
| 测试项目/Testing Items | 单位/ Unit | NWH18055 | 测试方法/ Testing Method | ||
| 产品构成/ Composition of product | μm | - | |||
| 铜箔/ Copper foil | 18 | ||||
| 胶粘剂/ Adhesive | 12 | ||||
| 总厚度/ Total thickness | 30±3 | ||||
| 剥离强度 Peeling intensity | 原始状态/ Original state | N/mm | ≥0.9 | JIS C 6471 8.1.5 | |
| 260C热冲击处理后/After being treated through 260C heat impulsion | ≥0.8 | ||||
| 180C热处理后/ After 180C heat treatment | ≥0.8 | ||||
| 浸药品处理后/ After being soaked in drugs | ≥0.8 | ||||
| 弯曲疲劳(最小值) / Flexural fatigue (min.) | Times | 1000 | JIS C 64718.2 | ||
| 表面电阻/ Surface resistance | Ω | 1.0 x 1012 | JIS C 6471 7.1 | ||
| 体积电阻/Volume resistance | 1.0 x 1012 | JIS C 6471 7.2 | |||
| 尺寸稳定性/ Dimensional stability | M.D. | % | -0.03 | JIS C 6471 9.6 | |
| T.D. | +0.01 | ||||
| 耐燃性/ Burning resistance | Grade | Pass | UL 94V-0/File No.E321938 | ||
